MP04HBN490-24 Datasheet, Dynex Semiconductor

s s s s s s Dual Device Module Electrically Isolated Package Pressure Contact Construction International Standard Footprint Alumina (Non Toxic) Isolation Medium Integral.

s s s s HBP HBN Fig.1 Circuit diagrams Motor Control Controlled Rectifier Bridges Heater Control AC Phase Control VOL.

MP04HBN490-26

MP04HBN490-28

MP04HB910

MP04HBP490-24

MP04HBP490-26

MP04HBP490-28

MP04HBT490-24

MP04HBT490-26

MP04HBT490-28

MP040

MP040-E

MP040B

MP040B-E